Throughout its history, Alaris Linwave has established and continues to develop a Chip and Wire capability, providing advanced RF solutions to its customer base when packaged devices are not available or will not provide the required performance.
Alaris Linwave has now significantly enhanced its die attach capability, by acquiring and commissioning a new Vacuum Solder Reflow Oven (VSRO), which is a critical requirement for high-frequency and high-reliability electronics manufacturing processes. It allows a range of bare die including power FETs and MMIC (Monolithic Microwave Integrated Circuit) to be precisely attached to matched substrates using advanced bonding methods such as eutectic soldering and epoxy attachment.
This advanced process delivers void-free, high-quality joints with outstanding thermal and electrical performance, directly translating into higher reliability, improved efficiency, and longer product life. The controlled vacuum environment ensures consistent quality and performance across production, giving our customers the confidence that every component will perform exactly as designed - even in the most demanding environments. The in-built cleaning function also ensures that components are in prime condition prior to undertaking the mount process, and are therefore less prone to void forming during the attach process.
In chip-and-wire applications, the VSRO is key to ensuring a flawless die attach, forming the foundation for reliable wire bonding and high-frequency performance. By creating a stable, thermally efficient interface between the MMIC and substrate, this process enhances signal integrity, power handling, and long-term device stability — essential advantages for customers operating in mission-critical RF, defence, and communications systems.
Watch this video for precision assembly in motion with the VSRO at Alaris Linwave.
How does Alaris Linwave Utilise This Technology to Benefit our Customers?
Alaris Linwave uses the VSRO within its in-house assembly process to integrate bare die devices into high-performance RF/microwave assemblies, modules and subsystems. Here’s how this translates into direct customer benefit:
· Exceptional reliability: Through void-free eutectic die attach and epoxy processes in a controlled vacuum environment, Alaris Linwave ensures robust, optimised thermal and electrical connections - reducing risks of failure in harsh environments.
· Consistent, repeatable performance: The VSRO allows for tightly-controlled process parameters (temperature profile, vacuum, gas atmosphere) so each unit has near-identical die-attach quality - meaning your modules behave predictably.
· High-frequency / high-power capability: The die-attach quality supports advanced GaN/GaAs MMICs, enabling Alaris Linwave’s modules to deliver strong RF performance in demanding bands and environments.
· Design flexibility and SWaP‐C advantage: Because Alaris Linwave has full “chip & wire” and die-level integration capability and experience, they can optimise packaging size, weight and power for each customer solution — enabling smaller, lighter, more efficient RF systems.
· Reduced time to field & lifecycle support: By having advanced assembly capability (including VSRO) in-house, Alaris Linwave is able to control quality, reduce lead-times, and support long-life programmes requiring custom or ruggedised RF components.
The VSRO / die-attach / chip-&-wire capability plays a critical role our manufacturing process and Alaris Linwave uses this capability in a variety of its products, for use in a range of markets and applications - from avionics, medical equipment and satellite communications to search and rescue operations and the defence industry.
In short, Alaris Linwave transforms this advanced assembly technology into tangible value for customers: superior performance, uncompromising reliability, and tailored RF solutions ready for the most demanding environments.
